CMP?Filtration

 

Chemical Mechanical Planarization(CMP) is a polishing process used to manufacture wafers for the semiconductor industry. it requires the use of a polishing tool and polishing slurry and treat wafers to be flat . Slurry filtration is a key process. The slurry particles range is 30-200um regularly, but some particle control is 0.5um. if unfiltered, scratch the wafer during polishing.

 

 


Back

高清亚洲日韩欧洲不卡在线观看-色婷婷五月在线精品免费视频-狼友网站免费进入-一级a爱大片夜夜春免费视频